AMMC 5618 PDF

AMMCW10 Broadcom / Avago RF Amplifier 6 – 20 GHz dB datasheet, inventory, & pricing. Avago Technologies’ AMMC GHz MMIC is an efficient two-stage amplifier designed to be used as a cascadable intermediate gain block for EW. Description Agilent’s AMMC- GHz MMIC is an efficient two- stage amplifier designed to be used as a cascadable intermediate gain block for EW.

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AMMCW10 Price & Stock | DigiPart

No ground wires are required because all ground connections are made with plated throughholes to the backside of the device. Ensure that an ESD approved carrier is used when dice are transported from one destination to another.

Ablebond LM1 silver epoxy is recommended. I’m interested in your product,if you could send me more data I appreiciate this. It is fabricated using a PHEMT integrated circuit structure that provides exceptional efficiency and flat gain performance.

The following precautions are strongly recommended: Isolation and Temperature 8 7 Figure For microstripline applications, the chip should be attached directly to the ground plane e. Operation in excess of any one of these conditions may result in permanent damage to this device. Thank you for your enquiry and you will be contacted soon. The chip is ? I would like to purchase this item. This helps simplify the assembly process and reduces assembly related performance variations and costs.

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AVAGO AMMC-5618 RF Amplifier

Thank you for your feedback. This can be accomplished by mounting a gold plated metal shim same length and width as the MMIC under the chip, which is of the correct thickness to ammmc the chip and adjacent circuit coplanar. Thermosonic wedge bonding is the preferred method for wire attachment to the bond pads.

Please enter a message. For microstripline applications, the chip should be attached directly to the ground plane e.

A single bond wire is sufficient for signal connections, however double-bonding with 0. San Pioneer Electronics Co. Cascadable gain stage for EW 568 Personal grounding is to be worn at all times when handling these devices.

This can be accomplished by mounting a gold plated metal shim same length and width as the Ammd under the chip, which is of the correct thickness to make the chip and adjacent circuit amc. To San Pioneer Electronics Co. It is fabricated using a PHEMT integrated circuit structure that provides exceptional efficiency and flat gain performance. Glad to serve you! In communication systems, it can be used as a LO buffer, or as a transmit driver amplifier.

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For best performance, the topside of the MMIC should be brought up to the same height as the circuit surrounding it. Input and Output Return Loss: Save this item to a new parts list. Noise Figure Figure 6. For best performance, the topside of the MMIC should be brought up to the same height as the circuit surrounding it.

Isolation and Voltage Figure 9. You agree that the Information as provided here through an intermediary may not be error-free, accurate or up-to-date and that it is not advice.

The Manufacturers reserve the right to change this Information at any time without notice. A single bond wire is sufficient for signal connections, however doublebonding with 0.